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                                Moldflow/C-MOLD Post-Filling + Juncture Losses


                                Test ID

                                G-003

                                Description

                                Properties needed to perform a Moldflow mold-filling and packing simulation, incorporating pressure drops in runners and gates, are generated. These include Bagley corrected viscosity vs. shear rate at three temperatures (two in the processing range and one below); thermal properties, and PVT data. The entrance pressure loss (Bagley correction) is applied to the viscosity data; the residual contraction pressure loss is correlated to shear stress. Viscosity and PVT data are fit to Moldflow models.

                                Included Tests

                                1x D-020 PVT (Isothermal Heating)
                                3x R-012 Capillary Rheology with Bagley Correction (1 Temperature)
                                1x R-018 No-Flow Temperature
                                1x T-015 Specific Heat
                                1x T-103 Thermal Conductivity Scan

                                Options

                                More advanced TestPaks are available to simulate shrinkage and warpage.

                                Samples

                                : 1 kg of pellets

                                [details]

                                : 1 parts, any shape

                                [details]

                                Application

                                In addition to all the software capabilities using Filling data, this TestPak enables the juncture loss calculation which permits the simulation of pressure drop across runners and gates due to extensional effects.

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